2.3 nm barrier AlN/GaN HEMTs with insulated gates
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چکیده
p s s current topics in solid state physics c status solidi
منابع مشابه
Quaternary Barrier InAlGaN HEMTs With fT/fmax of 230/300 GHz
Depletion-mode quaternary barrier In0.13Al0.83 Ga0.04N high-electron-mobility transistors (HEMTs) with regrown ohmic contacts and T-gates on a SiC substrate have been fabricated. Devices with 40-nm-long footprints show a maximum output current density of 1.8 A/mm, an extrinsic dc transconductance of 770 mS/mm, and cutoff frequencies fT /fmax of 230/300 GHz at the same bias, which give a record-...
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Record-low sheet-resistance of $ 128 O=sq have been obtained in two-dimensional electron gases at ultrathin single AlN/GaN heterojunctions by optimizing the metal fluxes used in molecular beam epitaxy growth. Multiple 2DEGs have been found in AlN/GaN superlattices, with the net electron density measured 4 1 Â 10 14 cm À2 at room temperature. This very high electron density also leads to a furth...
متن کاملAlN/GaN insulated gate HEMTs with HfO2 gate dielectric
AlN/GaN single heterojunction MOS-HEMTs grown by molecular beam epitaxy have been fabricated utilising HfO2 high-K dielectrics deposited by atomic layer deposition. Typical DC transfer characteristics of 1.3 mm gate length devices show a maximum drain current of 950 mA/mm and a transconductance of 210 mS/mm with gate currents of 5 mA/mm in pinch-off. Unity gain cutoff frequencies, ft and fmax, ...
متن کاملTechnology focus: GaN HEMTs
has been developing III-nitride double heterostructures (DHs) with indium gallium nitride (InGaN) channels with a view to high-electron-mobility transistors (HEMTs) [Yi Zhao et al, Appl. Phys. Lett., vol105, p223511, 2014]. The resulting structures boast the highest reported mobility for InGaN channels and superior transport at high temperature, according to the research team. Nitride semicondu...
متن کاملDependence of Electrical Properties of InAlN/GaN and InAlN/AlGaN/GaN Heterostructures FETs on the AlN Interlayer Thickness
We investigated the influence of the thickness of the AlN interlayer for InAlN/GaN and InAlN/AlGaN/GaN heterostructures. The AlN thickness strongly affects the surface morphology and electron mobility of the InAlN/GaN structures. The rms roughness of the surface increases from 0.35 to 1.2 nm with increasing AlN thickness from 0 to 1.5 nm. Large pits are generated when the AlN is thicker than 1 ...
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